Lexar Explains How Its Card-Thin Muse SSD Handles Heat and High-Speed Transfers
New technical disclosures detail the magnetic drive's thermal architecture, connector durability and potential 2TB version, months after its original announcement.
Technology news
Lexar has disclosed new engineering details about its unusually thin Muse portable SSD in an interview published by Digital Trends on November 2. The drive was originally introduced at IFA 2026 in September, so the current development is not a new product announcement. Instead, the latest reporting reveals how Lexar designed the storage device to operate while attached directly to a smartphone, including the methods used to manage heat and maintain a reliable data connection.
The Muse measures approximately one millimeter across its thinnest section and 3.8 millimeters at its thickest point, according to the manufacturer. Its card-like aluminum enclosure attaches magnetically to a phone using a compact connection system rather than a conventional USB-C socket built into the drive. That design is intended to reduce the bulk associated with external storage during handheld video recording, particularly when working with high-bitrate formats.
Heat management is one of the more revealing aspects of Lexar's explanation. The company told Digital Trends that the Muse uses a single-sided circuit-board layout and positions its primary heat-producing components away from the phone's rear surface. Its aluminum body functions as a passive heat spreader, while firmware monitors operating temperatures and can adjust performance when necessary. Lexar says the drive is designed to maintain performance during sustained 4K recording at 120 frames per second under normal operating conditions, although the interview does not establish independently measured sustained write speeds.
The magnetic SnapLink interface receives similar attention. Lexar says its gold-plated spring contacts are designed to preserve signal integrity over a 10Gbps USB connection. The company also describes durability testing involving more than 10,000 connection cycles, salt spray, high humidity and contaminants such as sweat, dust and textile fibers. These are manufacturer-reported engineering and testing claims, not independent laboratory findings.
Capacity expansion is another newly clarified detail. Lexar says the initial 512GB and 1TB configurations were not chosen because larger NAND packages could not physically fit inside the enclosure. A 2TB version is technically feasible and is undergoing validation, but the manufacturer has not committed to releasing it. The November interview therefore provides meaningful new information about the Muse's engineering and future possibilities without establishing a new retail launch date or confirming long-term performance in consumer use.